manufacturers still encounter various problems in the process of using it, resulting in poor edge banding effect, insufficient bonding strength, and even edge banding falling off, surface scratches, surface ridges, etc. Below, we will share with you the common problems and solutions of edge banding hot melt adhesive:

sol temperature, bonding substrate temperature, board moisture content, machine edge banding speed, glue application pressure, glue application amount and many other matters need to be paid attention to, otherwise, the bonded products are prone to weak bonding, false adhesion, etc. Let me share with you eva Some precautions for using edge-banding hot melt adhesive: